View TDA4670_319855.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TDA4670 Picture Signal Improvement (PSI) circuit
Product specification Supersedes data of May 1991 File under Integrated Circuits, IC02 1996 Dec 11
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
FEATURES * Luminance signal delay from 20 to 1100 ns (minimum step 45 ns) * Luminance signal peaking with selectable symmetrical overshoots * 2.6 or 5 MHz peaking centre frequency and selectable degree of peaking (-3, 0, +3 and +6 dB) * Selectable noise reduction by coring * Handles negative and positive colour-difference signals * Selectable Colour Transient Improvement (CTI) to decrease the colour-difference signal transient times to those of the high frequency luminance signals * Selectable 5 or 12 V sandcastle input voltage * All controls selected via the I2C-bus * Timing pulse generation for clamping and delay time control synchronized by sandcastle pulse * Automatic luminance signal delay correction using a control loop * Luminance and colour-difference input signal clamping with coupling capacitor * 4.5 to 8.8 V supply voltage range * Minimum of external components required. QUICK REFERENCE DATA SYMBOL VP IP(tot) td(Y) Vi(VBS) Vi(CD)(p-p) total supply current Y signal delay time composite Y input signal (peak-to-peak value, pin 16) colour-difference input signal (peak-to-peak value) (R - Y) on pin 3 (R - Y) on pin 7 GY GCD Tamb gain of Y channel gain of colour-difference channel operating ambient temperature - - - - 0 1.05 1.33 -1 0 - 1.48 1.88 - - 70 PARAMETER supply voltage (pins 1 and 5) MIN. 4.5 31 20 - 5 41 - 450 TYP. GENERAL DESCRIPTION
TDA4670
The TDA4670 delays the luminance signal and improves colour-difference signal transients. Additionally, the luminance signal can be improved by peaking and noise reduction (coring).
MAX. 8.8 52 1130 640 V
UNIT mA ns mV V V dB dB C
ORDERING INFORMATION TYPE NUMBER TDA4670 PACKAGE NAME DIP18 DESCRIPTION plastic dual in-line package; 18 leads (300 mil) VERSION SOT102-1
1996 Dec 11
2
Product specification
TDA4670
Fig.1 Block diagram.
handbook, full pagewidth
1996 Dec 11
100 nF 2 1 Vref GENERATION Vref I2C-BUS Vref Y delay sandcastle 5 V/12 V Vref CORING 5 MHz
-0.5
sandcastle pulse SDA SCL 100 nF 15 10 9 I2C-BUS RECEIVER CTI on/off coring on/off peaking frequency degree of peaking VP = 5 to 8 V
BLOCK DIAGRAM
17
Philips Semiconductors
SANDCASTLE PULSE DETECTOR
BK
BK, H + V DELAY TIME CONTROL
Y 100 ns 90 ns
16
BLACK LEVEL CLAMP
+
CORING 11 100 nF
100 nF
2.6 MHz
Vref control signal
-0.5
5 MHz 2.6 MHz I2C-BUS PEAKING
I2C-BUS BLACK LEVEL CLAMP 180 ns
+1
Picture Signal Improvement (PSI) circuit
3
90 ns 45 ns 90 ns 100 ns BLACK LEVEL CLAMP
450 ns
180 ns
+
100 nF
13
Vref
TDA4670
analog switch
12
Y
14
100 nF
Vref
-(R - Y)
3
10 nF FULL-WAVE RECTIFIER HIGH-PASS FILTER VT
BLACK LEVEL CLAMP
4 -(R - Y) I2C-BUS
DIFFERENTIATOR
BK FULL-WAVE RECTIFIER
storage capacitors comparator 6 -(B - Y) analog switch
DIFFERENTIATOR
-(B - Y)
7
10 nF
BLACK LEVEL CLAMP 8 18 5
Vref
MSA557
VP1 = 5 to 8 V
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
PINNING SYMBOL PIN VP1 CDL Vi(R - Y) Vo(R - Y) VP2 Vo(B - Y) Vi(B - Y) GND2 SDA SCL CCOR VoY CCLP1 CCLP2 Cref ViY SAND GND1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 DESCRIPTION positive supply voltage 1 capacitor of delay time control (R - Y) colour-difference input signal (R - Y) colour-difference output signal positive supply voltage 2 (B - Y) colour-difference output signal (B - Y) colour-difference input signal ground 2 (0 V) I2C-bus serial data input/output I2C-bus serial clock input coring capacitor delayed luminance output signal black level clamping capacitor 1 black level clamping capacitor 2 capacitor of reference voltage luminance input signal sandcastle pulse input ground 1 (0 V) Fig.2 Pin configuration.
handbook, halfpage
TDA4670
VP1 1 CDL 2 Vi(R - Y) 3 Vo(R - Y) 4 VP2 5 Vo(B - Y) 6 Vi(B - Y) 7 GND2 8 SDA 9
MEH188
18 GND1 17 SAND 16 ViY 15 Cref
TDA4670
14 CCLP2 13 CCLP1 12 VoY 11 CCOR 10 SCL
1996 Dec 11
4
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
FUNCTIONAL DESCRIPTION The TDA4670 contains luminance signal processing and colour-difference signal processing. The luminance signal section comprises a variable integrated luminance delay line with luminance signal peaking and noise reduction by coring. The colour-difference section consists of a transient improvement circuit to decrease the rise and fall times of the colour-difference signal transients. All functions and parameters are controlled via the I2C-bus. Y-signal path The video and blanking signal is AC-coupled to the input at pin 16. Its black porch is clamped to a DC reference voltage to ensure the correct operating range of the luminance delay stage. The luminance delay line consists of all-pass filter sections with delay times of 45, 90, 100, 180 and 450 ns (see Fig.1). The luminance signal delay is controlled via the I2C-bus in steps of 45 ns in the range of 20 to 1100 ns, this ensures that the maximum delay difference between the luminance and colour-difference signals is 22.5 ns. An automatic luminance delay time adjustment in an internal control loop (with the horizontal frequency as a reference) is used to correct changes in the delay time, due to component tolerances. The control loop is automatically enabled between the burst key pulses of lines 16 (330) and 17 (331) during the vertical blanking interval. The control voltage is stored in the capacitor CDL connected to pin 2. The peaking section uses a transversal filter circuit with selectable centre frequencies of 2.6 and 5 MHz. It provides selectable degrees of peaking of -3, 0, +3 and +6 dB and a noise reduction by coring, which attenuates the high-frequency noise introduced by peaking.
TDA4670
The output buffer stage ensures a low-ohmic VBS output signal on pin 12 (<160 ). The gain of the luminance signal path from pin 16 to pin 12 is unity. An oscillation signal of the delay time control loop is present on output pin 12 instead of the VBS signal during the vertical blanking interval in lines 16 (330) to 18 (332). Therefore, this output signal should not be applied for synchronization. Colour-difference signal paths The colour-difference input signals (on pins 3 and 7) are clamped to a reference voltage. Each colour-difference signal is fed to a transient detector and to an analog signal switch with an attached voltage storage stage. The transient detectors consist of differentiators and full-wave rectifiers. The output voltages of both transient detectors are added and then compared in a comparator. This comparator controls both following analog signal switches simultaneously. The analog signal switches are in an open position at a certain value of transient time; the held value (held by storage capacitors) is then applied to the outputs. The switches close to rapidly accept the actual signal levels at the end of these transients. The improved transient time is approximately 100 ns long and independent of the input signal transient time. Colour-difference paths are independent of the input signal polarity and have a gain of unity. The CTI functions are switched on and off via the I2C-bus.
1996 Dec 11
5
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
TDA4670
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). VP1 and VP2 as well as GND1 and GND2 connected together. SYMBOL VP1 VP2 Ptot Tstg Tamb VESD PARAMETER supply voltage (pin 1) supply voltage (pin 5) total power dissipation storage temperature operating ambient temperature electrostatic handling for pins 9 and 10 for other pins Note 1. Equivalent to discharging a 200 pF capacitor through a 0 series resistor. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE 82 UNIT K/W note 1 - - - +300 -500 500 V V V CONDITIONS 0 0 0 -25 0 MIN. MAX. 8.8 8.8 0.97 +150 70 UNIT V V W C C
CHARACTERISTICS VP1 = VP2 = 5 V; nominal video amplitude VVB = 315 mV; tH = 64 s; tBK = 4 s (burst key); Tamb = 25 C; measurements taken in Fig.4; unless otherwise specified. SYMBOL VP1 VP2 IP(tot) Y-signal path Vi(Y)(p-p) V16 I16 R16 C16 td(Y)(max) td(Y)(min) VBS input signal on pin 16 (peak-to-peak value) black level clamping voltage input current input resistance input capacitance maximum Y delay time minimum Y delay time set via I2C-bus set via I2C-bus during clamping outside clamping outside clamping - - 95 - 5 - 1070 - 450 3.1 - - - 3 1100 20 640 - 190 0.1 - 10 1130 - mV V A A M pF ns ns PARAMETER supply voltage (pin 1) supply voltage (pin 5) total supply current CONDITIONS MIN. 4.5 4.5 31 5 5 41 TYP. MAX. 8.8 8.8 52 UNIT V V mA
1996 Dec 11
6
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
TDA4670
SYMBOL td(Y)
PARAMETER minimum delay step group delay time difference delay time difference between Y and colour-difference signals set via
CONDITIONS I2C-bus f = 0.5 to 5 MHz; maximum delay Y delay; CTI and peaking off -
MIN. 40 0
TYP. 45
MAX. 50 25 130 245 0
UNIT ns ns ns ns dB
70 185
100 215 -1
td(peak)(min) GY
minimum delay time for peaking VBS signal gain measured on output pin 12 (composite signal, peak-to-peak value) output current (emitter-follower with constant current source) output resistance frequency response for maximum delay f = 0.5 to 3 MHz f = 0.5 to 5 MHz Vo/Vi; f = 500 kHz; maximum delay source current sink current
-2
I12 R12 fres
-1 0.4 - -2 -4 0.85 0.60
- - - -1 -3 - -
- - 160 0 -1 - -
mA mA dB dB - -
LIN
signal linearity for video contents of 315 mV (p-p) video contents of 450 mV (p-p)
min/max; VVBS = 450 mV (p-p) VVBS = 640 mV (p-p)
Luminance peaking, selected via I2C-bus fpeak Vpeak peaking frequency peaking amplitude for grade of peaking (fC amplitude/0.5 MHz amplitude) selectable values - - - - limitation of peaking (positive amplitude of correction signal referenced to 315 mV) Vn(rms) COR noise voltage on pin 12 (RMS value) coring of peaking (coring part referenced to 315 mV) without peaking; f = 0 to 5 MHz COR-bit = 1 - -3 0 +3 +6 20 - - - - - dB dB dB dB % fC1; LCF-bit = 0 fC2; LCF-bit = 1 4.5 2.3 5 2.6 5.5 2.9 MHz MHz
- -
- 20
1 -
mV %
1996 Dec 11
7
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
TDA4670
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Colour-difference paths measured with transient times tr = tf = 1 s; tp H 1 s; Vi = 1.33 V (p-p) on pins 3 and 7 and with burst key pulse tBK = 4 s Vi(CD)(p-p) (R - Y) input signal (peak-to-peak value; pin 3) (B - Y) input signal (peak-to-peak value; pin 7) input transient sensitivity V3,7 I3,7 C3,7 V4,6 V4,6 Vspike I4,6 R4,6 Gv Gv LIN internal clamping voltage level input current input capacitance DC output voltage output offset voltage spurious spike signals on pins 4 and 6 output current (emitter-follower with constant current source) output resistance signal gain in each path gain difference -(R - Y)/-(B - Y) signal linearity for nominal signal +3 dB signal Vo signal reduction at higher frequency (output signal ratio Vi/Vo) min/max; Vi = 1.33 V (p-p) Vi = 1.88 V (p-p) signal with tp H = 50 ns; tr = tf = 1 s 0.90 0.65 -1.5 - - - - - - - - dB Vo/Vi RS 300 ; note 1 RS 300 ; note 1 source current sink current outside clamping during clamping 75% colour bar 75% colour bar V3,7/t - - 0.15 - - 100 - - - - -1 0.4 - -1 - during and after storage time - 1.05 1.33 - 2.45 - - 6 2 - - - - - - 0 0 1.48 1.88 - - 1 190 12 - 5 18 30 - - 100 +1 0.3 V V V/s V A A pF V mV mV mV mA mA dB dB
Sandcastle pulse, input voltage selectable via I2C-bus V17 input voltage threshold for H and V sync input voltage threshold for burst input voltage threshold for H and V sync input voltage threshold for burst R17 C17 tBK td np input resistance input capacitance burst key pulse width leading edge delay for clamping pulse number of required burst key pulses vertical blanking interval referenced to tBK note 2 SC5-bit = 0 (+12 V) SC5-bit = 0 (+12 V) SC5-bit = 1 (+5 V) SC5-bit = 1 (+5 V) +12 V input level +5 V input level 1.1 5.5 1.1 3.0 30 15 - 3.0 - 4 1.5 6.5 1.5 3.5 40 20 4 4.0 1 - 1.9 7.5 1.9 4.0 50 25 8 4.6 - 31 V V V V k k pF s s -
1996 Dec 11
8
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
TDA4670
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
I2C-bus control, SDA and SCL VIH VIL I9,10 Vo(ACK) Io(ACK) Notes 1. Crosstalk on output, measured in the unused channel when the other channel is provided with a nominal input signal (CTI active). 2. A number of more than 31 burst key pulses repeats the counter cycle of delay time control. I2C-BUS FORMAT S(1) Notes 1. S = START condition. 2. SLAVE ADDRESS = 1000 100X. 3. ACK = acknowledge, generated by the slave. 4. SUBADDRESS = subaddress byte, see Table 1. 5. DATA = data byte, see Table 1. 6. P = STOP condition. 7. X = read/write control bit. X = 0, to write (the circuit is slave receiver only). If more than 1 byte DATA is transmitted, then auto-increment of the subaddress is performed. Table 1 I2C-bus transmission; see Table 2 DATA FUNCTION Y delay/CTI/SC Peaking and coring SUBADDRESS D7 00010000 00010001 0 COR D6 SC5 PEAK D5 CTI LCF D4 DL4 0 D3 DL3 0 D2 DL2 0 D1 DL1 D0 DL0 SLAVE ADDRESS(2) ACK(3) SUBADDRESS(4) ACK(3) DATA(5) P(6) HIGH level input voltage on pins 9 and 10 LOW level input voltage input current output voltage at acknowledge on Io(ACK) = 3 mA pin 9 output current at acknowledge on sink current pin 9 3 0 - - 3 - - - - - 5 1.5 10 0.4 - V V A V mA
PCON1 PCON0
1996 Dec 11
9
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
Table 2 Function of the bits DATA DL0 DL1 DL2 DL3 DL4 CTI SC5 LCF PEAK COR PCONx Table 3 PCON1 0 0 1 1 set colour transient improvement select sandcastle pulse voltage set peaking frequency response set peaking delay set coring control set peaking amplification Peaking amplification PCON0 0 1 0 1 GRADE OF PEAKING (dB) -3 0 +3 +6 FUNCTION set delay in luminance channel LOGIC 1 45 ns 90 ns 180 ns 180 ns 450 ns active +5 V 2.6 MHz active active
TDA4670
LOGIC 0 0 ns 0 ns 0 ns 0 ns 0 ns inactive +12 V 5.0 MHz inactive inactive
see Table 3
Remarks to the subaddress bytes Subaddresses 00H to 0FH are reserved for colour decoders and RGB processors. Subaddresses 10 and 11 only are acknowledged. General call address is not acknowledged. Power-on-reset: D7 to D1 bits of data bytes are set to logic 0, D0 bit is set to logic 1.
1996 Dec 11
10
SC 15 14 13 12
Y input
Cref CCLP CCLP
Y output
Product specification
TDA4670
Fig.3 Internal circuit.
handbook, full pagewidth
1996 Dec 11
+ + + +
11 CCOR
17
16
Philips Semiconductors
INTERNAL CIRCUITRY
+
GND
18
+
all input and output pins without pins 9 and 10
TDA4670
+
Picture Signal Improvement (PSI) circuit
11
+ +
4 CD output VP 5 6 CD output 7 CD input 8
VP
1
+
10
SCL
+
2
3
9 GND SDA
MEH238
CDL
CD input
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
TEST AND APPLICATION INFORMATION
TDA4670
handbook, full pagewidth
SDA I2C-bus SCL CCOR 0.1 F (VBS) VoY 10 9 GND2 Vi(B - Y) 10 nF Vo(B - Y) VP2 Vo(R - Y) Vi(R - Y) CDL VP1 10 nF 0.1 F +5 V 47 F SDA
11
8
12
7
CCLP1 0.1 F CCLP2 0.1 F Cref 0.1 F (VBS) sandcastle pulse input ViY 0.1 F SAND
13
6
14
TDA4670
5
15
4
16
3
17 GND1
2
18
1
MEH189
15 VB
Fig.4 Test and application circuit.
1996 Dec 11
12
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil)
TDA4670
SOT102-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 18 10 b2 MH wM (e 1)
pin 1 index E
1
9
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.044 b1 0.53 0.38 0.021 0.015 b2 1.40 1.14 0.055 0.044 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 0.85 0.033
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT102-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-10-14 95-01-23
1996 Dec 11
13
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA4670
with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1996 Dec 11
14
Philips Semiconductors
Product specification
Picture Signal Improvement (PSI) circuit
NOTES
TDA4670
1996 Dec 11
15
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 247 9145, Fax. +7 095 247 9144 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/1200/03/pp16
Date of release: 1996 Dec 11
Document order number:
9397 750 01471

▲Up To Search▲

Price & Availability of TDA4670

	To Download TDA4670 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .